free silver

美 　英

• na.〈美〉銀幣的自由鑄造
• 網(wǎng)絡(luò)銀幣鑄造；自由銀幣；銀幣自由鑄造

英漢解釋

na.	1. 〈美〉銀幣的自由鑄造

例句

to further reduce equivalent series resistance and improve long term reliability , the leads are then soldered with lead free silver solder.

為了進(jìn)一步的減少等效串聯(lián)阻抗和改善，長(zhǎng)期的信賴度，引線是以無鉛銀焊錫來接焊。

Development process and status guo of cyanide -free silver plating technology were introduced.

介紹了無氰鍍銀的發(fā)展過程和技術(shù)現(xiàn)狀。

McKinley convinced the people that the Free Silver Movement was a bad idea.

麥金利說服選民相信自由鑄造銀幣運(yùn)動(dòng)是一個(gè)壞點(diǎn)子。

Only two million points for a free silver fondue set!

兩百萬點(diǎn)就可以免費(fèi)換得一套銀制火鍋組！

The political campaign of 1896 was raging over the issue of Free Silver.

1896的政治運(yùn)動(dòng)在激烈地爭(zhēng)執(zhí)有關(guān)“銀幣的自由鑄造”的問題。

A cyanide -free silver electroplating process with 5, 5 - dimethyl hydantoin as coordination agent is studied.

研究了5,5-二甲基乙內(nèi)酰脲為配位劑的無氰鍍銀工藝。

Do you remember that he had the free silver policy.

你還記得他實(shí)行過自由鑄造銀幣政策嗎？

cyanide -free silver plating; development; research status quo; environment protection;

無氰鍍銀；發(fā)展；研究現(xiàn)狀；環(huán)境保護(hù)；

The Historical Origins and Its Far-reaching Influence of the Free Silver Movement

美國白銀運(yùn)動(dòng)的歷史淵源及其久遠(yuǎn)影響

A Study of Additives for Cyanide-free Silver Plating

無氰鍍銀添加劑的研究

Research status and prospect of cadmium free silver filler metal for brazing

無鎘銀釬料研究現(xiàn)狀與發(fā)展趨勢(shì)

Two-Direction Pulse Plating Process for Cyanide-Free Silver Plating

雙向脈沖無氰鍍銀工藝研究

Study on the Thiosulfate Cyanide-free Silver Pulse Plating Process

硫代硫酸鹽無氰脈沖鍍銀工藝研究

Technology and Status Quo of Cyanide-free Silver Plating Technique

無氰鍍銀的工藝與技術(shù)現(xiàn)狀

Study on the Production Technology of Cyanide-free Silver Plating

無氰鍍銀生產(chǎn)技術(shù)實(shí)驗(yàn)研究

Study of Lead- free Silver Termination Paste for MLCI

MLCI銀端漿的無鉛化研究

Study on the Cyanide-Free Silver Brush Plating on Copper Substrate

銅基無氰電刷鍍銀研究

Research Progress in Cyanide-free Silver Plating

無氰鍍銀研究進(jìn)展

The Study on Cyanide-free Silver Electroplating on Copper Substrate

銅基無氰鍍銀的研究